Penetration of copper-manganese self-forming barrier into SiO2 pore-sealed SiCOH during deposition

Juan Borja, Joel L. Plawsky, William N. Gill, Hassaram Bakhru, Ming He, Toh Ming Lu

Research output: Contribution to journalArticlepeer-review

Abstract

The incorporation of a self-forming Cu diffusion barrier on pore-sealed SiCOH was investigated. SiCOH films 20% porous and 230 nm thick were capped with 36 nm SiO2. Fabricated structures (Cu-Mn/SiO2/SiCOH) were subjected to a back-side Secondary Ion Mass Spectrometry (SIMS) depth profile study to assess the extent of metal migration. SIMS depth profiles revealed that Cu and Mn diffused in significant amounts across the SiO2 layer during fabrication steps. A mass transport model was used to describe the migration of metal species. The diffusion coefficient for Cu in the SiO 2 pore-sealing layer is approximately D∼5.62 × 10- 16 cm2/sec.

Original languageEnglish
Pages (from-to)N175-N178
JournalECS Journal of Solid State Science and Technology
Volume2
Issue number9
DOIs
StatePublished - 2013
Externally publishedYes

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