Theory of Dielectric Breakdown in Nano-Porous Thin Films

Juan Pablo Borja, Toh Ming Lu, Joel Plawsky

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review


Dielectric breakdown and its relation to computer chip components and interconnects have been covered in the previous chapters. Multiple theories were presented to describe mechanisms that can result in failure. In addition, it was discussed how such mechanisms can be affected by material properties, fabrication steps, and type of stress. Complex concepts have been reduced to empirical expression and fitting parameters. These methodologies have been shown to replicate experimental data in high-field and high-temperature conditions. However, a great deal of uncertainty remains about whether they can accurately and cohesively describe breakdown behavior and values in device operating conditions. The present chapter will pursue a higher level of understanding about dielectric failure and the fundamental mechanisms that control it. The concepts discussed in previous chapters as well as some novel ideas have been merged to generate a comprehensive physical description of the phenomena. This physical description has been translated into mathematical terms by using transport equations for major species participating in dielectric failure. Our intent is to generate a framework for general dielectric breakdown in nano-porous thin films that can be applied to multiple systems.

Original languageEnglish
Title of host publicationSpringerBriefs in Materials
Number of pages15
StatePublished - 2016
Externally publishedYes

Publication series

NameSpringerBriefs in Materials
ISSN (Print)2192-1091
ISSN (Electronic)2192-1105

Bibliographical note

Publisher Copyright:
© 2016, The Author(s).


  • Amorphous film
  • Charge transport
  • Dielectric breakdown
  • Electron
  • Intrinsic failure
  • Mechanism
  • Metal ion
  • Model
  • Traps


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