A Low-Cost IoT Platform for Heat Stress Monitoring in Dairy Cattle

Juan J. Choquehuanca-Zevallos, Efrain Mayhua-Lopez

Resultado de la investigación: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

Resumen

This paper presents a compact and modular system based on Internet-of- Things for monitoring cattle behavior and stress in real-time. It will help to model certain parameters such as temperature and certain weather variables such as relative humidity, solar radiation, among others thanks to Internet-of- Things (IoT) sensors localized in different points of barns and the fields for cattle farming. A main benefit of the system is that it is built with low-cost hardware and low battery consumption. The wireless system also allows the collection of data in real-time and obtains the temperature-humidity index. This index will give an approach to the heat stress in cattle not only on the farm but in the vicinity of the farm. Finally, the high amount of collected data will allow employing Big Data solutions for estimating the impact on milk productivity. In the future, more sensors will be deployed for a more detailed reading of weather variables and their impact on dairy cattle.

Idioma originalInglés
Título de la publicación alojada2021 IEEE 6th International Conference on Computer and Communication Systems, ICCCS 2021
EditorialInstitute of Electrical and Electronics Engineers Inc.
Páginas982-986
Número de páginas5
ISBN (versión digital)9780738126043
DOI
EstadoPublicada - 23 abr. 2021
Publicado de forma externa
Evento6th IEEE International Conference on Computer and Communication Systems, ICCCS 2021 - Chengdu, China
Duración: 23 abr. 202126 abr. 2021

Serie de la publicación

Nombre2021 IEEE 6th International Conference on Computer and Communication Systems, ICCCS 2021

Conferencia

Conferencia6th IEEE International Conference on Computer and Communication Systems, ICCCS 2021
País/TerritorioChina
CiudadChengdu
Período23/04/2126/04/21

Nota bibliográfica

Publisher Copyright:
© 2021 IEEE.

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